Description
Features:
3D laser square hole BGA reballing stencil template.
High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient.
New patented phone X Middle Layer Motherboard for Phone X Middle layer motherboard.
Assisting professionals to do Phone X BGA reballing in the most convenient and safest way.
Specification:
Type: for PHone 8/8p / for PHone 7/7p / for PHone 6s/6sp / for PHone 6/6p
Package included:
1 x BGA Reballing Tool
Details pictures:
